3D-Printed Electronics Innovator Nano Dimension Joins Techniplas Open Innovation Program

VENTURA, Calif., Jan. 9, 2018 /PRNewswire/ -- Techniplas, a leading global design and manufacturing provider of automotive products and services, today announced that Nano Dimension, a leading additive electronics provider (NASDAQ: NNDM) (TASE: NNDM), joined its open innovation program to make available for the first time to the automotive industry additive manufacturing of conductive components, encapsulated sensors and smart surfaces.

This partnership brings together Techniplas' cognitive lighting technology with Nano Dimension's 3D printed electronics to deliver new ways of designing and manufacturing electronic conductive paths directly into the interior and facia surfaces of cars in a single step. Nano Dimension is the first company to embed conductive paths and print antennas into shapes, and 3D print fully functioning printed circuit boards, the heart of all electronic devices. The company invites CES 2018 attendees to stop by Techniplas booth #9100 located in the Las Vegas Convention Center North Hall and experience first-hand the powerful combination of these technologies.

As part of this partnership, Nano Dimension plans to bring its industrial-grade DragonFly 2020 Pro 3D Printer into the Techniplas additive manufacturing Innovation Center, and apply its extensive advanced inkjet engineering materials expertise to accelerate the development of next-generation cognitive connected vehicle parts, components, and systems.

"We are thrilled to welcome Nano Dimension as a member of our program which brings together today's best and most innovative players and technologies," said Techniplas founder and chairman George Votis. "With Nano Dimension on board, we are the first to bring additive electronics capabilities to our automotive customers."

"Techniplas' open innovation program is fast becoming the preeminent hub for innovative 3D printing companies to validate and mainstream their additive manufacturing solutions for the automotive industry," said Nano Dimension CEO Amit Dror. "Together, we plan to lay the foundation for a new era of connected mobility and automotive products that are unencumbered by traditional design and manufacturing restrictions."

Nano Dimension's flagship DragonFly 2020 Pro 3D Printer is poised to transform electronic additive manufacturing by empowering companies to take control of their entire development cycle. The award-winning system enables the 3D-printing of functional electronics such as sensors, conductive geometries, antennas, molded connected devices, printed circuit boards and other devices.

Nano Dimension joins like-minded innovative partners, including DWS, Sharebot and Sicnova as part of Techniplas' Open Innovation Program, to fundamentally push the traditional boundaries of automotive manufacturing. Techniplas' continued commitment to the open innovation is supported by its focus on developing partnerships that see mutual benefits in each other's capabilities and strengths. With a breadth of in-house capabilities ranging from jigs and fixtures to larger scale prototypes, and short run manufacturing of end-use parts, Techniplas and its innovation partners are well on their way toward industry 4.0 readiness.

About Techniplas

Techniplas is a leading global design and manufacturing provider of engineered products and services that are helping to shape the future of mobility. Our 2,000 associates around the world are passionate about making the connected world. By continuously expanding the reach of our data enabled cognitive technologies into everything we do, we deliver personalized, performance-enhanced and sustainable mobility. For more information, please visit www.techniplas.com.

About Nano Dimension

Nano Dimension (TASE: NNDM) (NASDAQ: NNDM) is a leading additive manufacturing company that is disrupting, reshaping and defining the future of how electronics are made. With its unique 3D printing technologies, Nano Dimension is targeting the growing demand for electronic devices that require increasingly sophisticated features and rely on printed circuit boards. For more information, please visit www.nano-di.com.

Forward-Looking Statements

This press release contains forward-looking statements within the meaning of the "safe harbor" provisions of the Private Securities Litigation Reform Act of 1995 and other Federal securities laws. Words such as "expects," "anticipates," "intends," "plans," "believes," "seeks," "estimates" and similar expressions or variations of such words are intended to identify forward-looking statements. For example, Nano Dimension is using forward-looking statements in this press release when it discuss  the potential of its collaboration with Techniplas, and that it will apply its extensive inkjet advanced engineering materials expertise to accelerate the development of next-generation cognitive connected vehicle parts, components, and systems. Because such statements deal with future events and are based on Nano Dimension's current expectations, they are subject to various risks and uncertainties. Actual results, performance or achievements of Nano Dimension could differ materially from those described in or implied by the statements in this press release. The forward-looking statements contained or implied in this press release are subject to other risks and uncertainties, including those discussed under the heading "Risk Factors" in Nano Dimension's annual report on Form 20-F filed with the Securities and Exchange Commission ("SEC") on March 7, 2017, and in any subsequent filings with the SEC. Except as otherwise required by law, Nano Dimension undertakes no obligation to publicly release any revisions to these forward-looking statements to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events.

 

3D-Printed Electronics Innovator Nano Dimension Joins Techniplas Open Innovation Program

3D-Printed Electronics Innovator Nano Dimension Joins Techniplas Open Innovation Program

3D-Printed Electronics Innovator Nano Dimension Joins Techniplas Open Innovation Program

Nano Dimension

SOURCE Techniplas

For further information: TECHNIPLAS MEDIA CONTACT: Alyssa Hoyt, alyssa@xponentialworks.com, +1 (310) 691-0788; Rachel Broyde, Silicon Valley Communications, Broyde@siliconvpr.com, +1720-477-6090; NANO DIMENSION MEDIA CONTACT: Galit Beck, Public Relations Manager | 972-542539495 | galit@nano-di.com, NANO DIMENSION INVESTOR RELATIONS: Miri Segal-Scharia, CEO, MS-IR LLC | 917-607-8654 | msegal@ms-ir.com