In this section of the CES exhibitor media center, you'll find press releases from CES and exhibitors. The releases are listed in chronological order and are archived by month and year.
Month Year
| Su | Mo | Tu | We | Th | Fr | Sa |
|---|---|---|---|---|---|---|
Month Year
| Su | Mo | Tu | We | Th | Fr | Sa |
|---|---|---|---|---|---|---|
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Jan 3, 2017-- New platform unifies functionality through virtually seamless connectivity and delivers simplicity of use across devices and technologies --
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Jan 3, 2017-- Qualcomm Technologies' First 10nm System-on-Chip to Provide World-Class Performance and Enhanced Power Efficiency --
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Jan 3, 2017--New Platform Solutions Using the Snapdragon X16 LTE Modem Help Automakers Integrate All Key Connectivity Technologies for Connected Cars--
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Jan 3, 2017- Built on 10-nanometer FinFET Technology, Snapdragon 835 Uniquely Delivers the Power Efficiency and Performance Required for the Compact and Sleek ODG R-8 and R-9 Mobile AR/VR smartglasses -
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Jan 3, 2017--Audi, Ericsson, Qualcomm Technologies, SWARCO Traffic Systems and the University of Kaiserslautern to Begin Testing Program in 2017--
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Jan 3, 2017--Upcoming Volkswagen AG Vehicles to Feature Snapdragon 820A Processor, and Snapdragon X12 and X5 LTE Modems, to Deliver Compelling In-car Experiences--
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Jan 3, 2017- World's First Bluetooth Audio System-on-Chip with Integrated Active Noise Cancelling Technology Designed to Meet Demand for High-quality Wireless Sound -
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Jan 3, 2017-- Leading Module Makers Quectel and Telit to Offer First LTE Cat-M1 Modules Using Qualcomm Technologies' MDM9206 LTE Modem With Support for Verizon's ThingSpace Platform --
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Jan 3, 2017-- Supports high quality sound over completely wire free earbuds. Cost-optimized Reference Design now available
Jan 3, 2017Auto 1080HD Recording of Video and Stills + App-Controlled Functionality and Card/Cloud Based Storage Tell Your Side of the Story, Be It an Accident, Road Rage, or Traffic Stop
