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30, Magokjungang 10-ro
Gangseo-gu, Seoul 07796
Republic of Korea
Company Contact
Wendy Lee
Public Relations Team

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LG Innotek: LG Innotek, Korea's first electronic components company, founded in 1970, has grown into a leading global material and component company by intensely fostering world-class products through continuous technological development and process innovations.  We supply global customers with essential materials and components across the mobile, automotive, display, semiconductor, and IoT industries. Our state-of-the-art global product offerings include smartphone-camera modules, semiconductor substrates for communication, and photomasks for display. In addition, there are also connectivity, motor, power, and lighting technologies for EV and autonomous driving solutions. These products are developed and produced at our business sites, both domestic and abroad.

We are experts in core component design, mass production, and precision manufacturing. Today, we are the world’s leading provider of semiconductor substrates, autonomous driving sensing modules, automotive communication solutions (modules, motors, power, and lighting), and display power and electronic components. We are also the number one brand in the global camera module market.

More information can be found on our website (

LG Innotek CES 2023 Virtual Showroom

News Releases
Apr 27, 2023

On the 27th, LG Innotek (CEO Jeong Cheol-dong) announced on winning the US 'Edison Awards 2023' with the magnetic component evaluated to open the new era of ultra-slim and ultra high-definition...

Apr 6, 2023

LG Innotek (CEO Cheol-dong Jeong) announced on the 6th on succeeding the development of '5G-V2X Cellular Module' that is significantly improved with the long-distance data transmission based on...

Feb 27, 2023

Supporting high-resolution display... Expected to increase the level of immersion for users. Flexibility and unbounded design with thin films Creating differentiated customer values with 2-Metal...

Feb 9, 2023

Developed an 800V wireless BMS for the first time in the industry. The BMS combines the essential components for wireless communication into one module that is compatible with all communication chips.

Feb 2, 2023

New FC-BGA Substrate unveiled in the CES 2023 1st Significant production achieved in last year, Full-Scale Production will be possible in the 2nd half of this this year CEO Jeong Cheol-dong...

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